SAN JOSE -- Samsung Electronics Co. izatangiza serivisi zo gupakira ibintu mu buryo bwa 3D (HBM) mu mwaka utaha, ikoranabuhanga ryitezwe ko rizakoreshwa mu buryo bwa HBM4 yo mu gisekuru cya gatandatu cy’iyi chip y’ubuhanga bw’ubukorano izashyirwa ahagaragara mu 2025, nk’uko bivugwa n’isosiyete n’inganda.
Ku itariki ya 20 Kamena, ikigo kinini ku isi gikora chips zo kwibuka cyashyize ahagaragara ikoranabuhanga ryacyo rigezweho ryo gupakira chips hamwe n'inzira za serivisi mu nama ya Samsung Foundry Forum 2024 yabereye i San Jose, muri California.
Ni ubwa mbere Samsung ishyize ahagaragara ikoranabuhanga rya 3D packing kuri HBM chips mu birori byabereye mu ruhame. Kuri ubu, HBM chips zipfunyitse ahanini hakoreshejwe ikoranabuhanga rya 2.5D.
Byabaye nyuma y'ibyumweru bibiri, uwashinze Nvidia akaba n'umuyobozi mukuru, Jensen Huang, ashyize ahagaragara imiterere mishya ya platform yayo ya AI Rubin, ubwo yatangaga ikiganiro muri Tayiwani.
HBM4 ishobora kuzashyirwa muri moderi nshya ya Nvidia ya Rubin GPU yitezwe kumenyekana mu 2026.
IKORANABUHANGA RYO MU BURYO BWO GUHANGANA
Ikoranabuhanga rigezweho rya Samsung mu gupakira ririmo utumashini twa HBM dushyizwe hejuru ya GPU kugira ngo twihutishe kwiga amakuru no gutunganya amakuru, ikoranabuhanga rifatwa nk'iryahinduye ibintu ku isoko rya utumashini twa AI ririmo gukura cyane.
Muri iki gihe, utubumbe twa HBM duhujwe mu buryo butambitse na GPU kuri silicon interposer hifashishijwe ikoranabuhanga rya 2.5D packing.
Ugereranije, gupakira mu buryo bwa 3D ntibisaba silicon interposer, cyangwa substrate nto iri hagati y’udupira kugira ngo bishobore kuvugana no gukorana. Samsung yita ikoranabuhanga ryayo rishya ryo gupakira SAINT-D, mu magambo ahinnye Samsung Advanced Interconnection Technology-D.
SERIVISI YO GUTUMIZA IBIKORESHO
Bizwi ko iyi kompanyi yo muri Koreya y'Epfo itanga ibikoresho bya 3D HBM ku buryo bwihuse.
Kugira ngo ibi bishoboke, itsinda ryayo rishinzwe gupakira rigezweho rizahuza utwuma twa HBM twakorewe mu ishami ryayo ry’ubucuruzi bw’ububiko n’utwuma twa GPU twakusanyirijwe ibigo bidafite ibishushanyo mbonera n’ishami ryayo rishinzwe gushushanya.
"Gupakira 3D bigabanya ikoreshwa ry'amashanyarazi no gutinda kuyatunganya, bikongera ubuziranenge bw'ibimenyetso by'amashanyarazi bya chips za semiconductor," nk'uko byatangajwe n'umukozi wa Samsung Electronics. Muri 2027, Samsung irateganya gutangiza ikoranabuhanga ritandukanye ryo guhuza ibintu bitandukanye rikoresha ibintu by'urumuri byongera cyane umuvuduko wo kohereza amakuru ya semiconductors muri paki imwe y'ibikoresho by'ikoranabuhanga bya AI.
Mu rwego rwo gukomeza gukenera chips zikoresha ingufu nke kandi zikora neza, HBM iteganijwe kuzagira 30% by'isoko rya DRAM mu 2025 ivuye kuri 21% mu 2024, nk'uko TrendForce, ikigo cy'ubushakashatsi cyo muri Tayiwani kibitangaza.
MGI Research iteganya ko isoko ry’ibipfunyika rigezweho, harimo n’ibipfunyika bya 3D, rizazamuka rikagera kuri miliyari 80 z’amadolari mu 2032, ugereranyije na miliyari 34.5 z’amadolari mu 2023.
Igihe cyo kohereza: Kamena-10-2024