Inteko n'inganda n'inkomoko y'ikigo n'inganda n'inganda n'inganda zivuga ko SAN - Samsung Electronics Con.
Ku ya 20 Kamena, chipmaker nini cyane ku isi yahujwe n'ikoranabuhanga rya Chip yabereye hamwe na moshi ya serivisi ku ihuriro rya Samsung 2024 ryabereye i San Jose, muri Californiya.
Bwari ubwambere Samsung kugirango arekure tekinoroji ya 3d ya 3D ya chip ya HBM mubibazo rusange. Kugeza ubu, Chip ya HBM ipakiye cyane cyane hamwe na tekinoroji ya 2.5D.
Nyuma y'ibyumweru bibiri n'vidia hamwe na Nvidia hamwe na hungang umuyobozi mukuru yashyize ahagaragara ubwubatsi bushya bwa Platforme ya Ai Platformes mu mvugo muri Tayiwani.
HBM4 birashoboka ko yinjijwe muri moderi nshya ya Nvidia GPU biteganijwe ko yakwibasira isoko muri 2026.
Ihuza rya Vertical
Ikoranabuhanga rya Samsung ryagezweho rya Samsung rigaragaramo HBM yashyizwe mu buryo buhagaze hejuru ya GPU kugirango ikomeze kwihutisha amakuru no gutunganya ibintu byinshi mu isoko ryihuta cyane.
Kugeza ubu, chip chip ya HBM itarya neza hamwe na GPU kumufatanyabikorwa wa Silicon munsi yikoranabuhanga rya 2.5D.
Mugereranije, 3d ipakiye ntabwo bisaba interposer ya silicon, cyangwa substrate yoroheje yicaye hagati ya chani kugirango ibemererwe no gukorera hamwe. Samsung Dubs tekinoroji yo gupakira gishya nka Saint-d, ngufi kuri Samsung Ikoranabuhanga rya Ikoranabuhanga-d.
Serivisi
Isosiyete ya Koreya yepfo irasobanukirwa kugirango itange 3D gupakira HBM kumurongo.
Kugira ngo ukore, itsinda ryayo rishingiye ku gupakira rizahagarika umutima uhagaritse ku nkomoko ya HBM yakozwe mu gice cyacyo cyo kwibuka hamwe na Gpus yateranije ibigo by'umuhimbano ku bigo byashizwemo.
Umukozi wa Escutledoncy avuga ati: "3d ipakira igabanya ibyo kurya no gutunganya ingufu, kuzamura ireme ry'ibimenyetso by'amashanyarazi bya Semiconductor Chips." In 2027, Samsung plans to introduce all-in-one heterogeneous integration technology that incorporates optical elements that dramatically increase the data transmission speed of semiconductors into one unified package of AI accelerators.
Mu rwego rwo kwihitiramo imbaraga zo gukura kw'imbaraga zo hasi, imikorere miremire, HBM iteganijwe ko igizwe na 30% by'isoko rya Dram muri 2125 ryo mu 2024.
Ubushakashatsi bwa MGI buteganya ko isoko ripakira rishingiye ku bipamba, harimo 3d ipakira, gukura kugeza kuri miliyari 80 z'amadolari saa 2032, ugereranije na miliyari 34.5 z'amadolari muri 2023.
Igihe cyohereza: Jun-10-2024