SAN JOSE - Samsung Electronics Co izashyira ahagaragara serivisi zo gupakira ibintu bitatu (3D) kugirango bibuke umurongo mugari (HBM) mugihe cyumwaka, tekinoroji iteganijwe ko izashyirwa mubikorwa bya chip artificiel chip ya moderi ya gatandatu ya HBM4 guhera mu 2025, ukurikije isosiyete n'amasoko y'inganda.
Ku ya 20 Kamena, chipmaker nini cyane ku isi yashyize ahagaragara ikoranabuhanga rigezweho ryo gupakira chip hamwe n’ibishushanyo mbonera bya serivisi mu ihuriro rya Samsung Foundry Forum 2024 ryabereye i San Jose, muri Californiya.
Bwari ubwambere Samsung isohora tekinoroji yo gupakira 3D ya chip ya HBM mugikorwa rusange.Kugeza ubu, chip ya HBM ipakiwe cyane hamwe na tekinoroji ya 2.5D.
Bibaye nyuma y'ibyumweru bibiri nyuma yuko uwashinze Nvidia akaba n'umuyobozi mukuru, Jensen Huang yashyize ahagaragara imyubakire mishya yububiko bwa AI platform Rubin ubwo yavugiraga muri Tayiwani.
HBM4 birashoboka ko izashyirwa mubikorwa bishya bya Nvidia Rubin GPU biteganijwe ko izagera ku isoko mu 2026.
IHURIRO RIKURIKIRA
Tekinoroji ya Samsung iheruka gupakira igaragaramo chip ya HBM yashyizwe hejuru hejuru ya GPU kugirango irusheho kwihutisha imyigire yamakuru no gutunganya imyanzuro, ikoranabuhanga rifatwa nkimpinduka zumukino ku isoko rya AI rikura vuba.
Kugeza ubu, chip ya HBM ihujwe mu buryo butambitse na GPU kuri interineti ya silicon munsi ya tekinoroji yo gupakira 2.5D.
Mugereranije, gupakira 3D ntibisaba interposer ya silicon, cyangwa substrate yoroheje yicaye hagati ya chip kugirango ibemerera kuvugana no gukorera hamwe.Samsung yise tekinoroji nshya yo gupakira nka SAINT-D, mugufi kuri Samsung Advanced Interconnection Technology-D.
UMURIMO WA TURNKEY
Isosiyete yo muri Koreya yepfo yunvikana gutanga ibicuruzwa bya 3D HBM kumurongo.
Kugirango ubigereho, itsinda ryayo ryapakiye murwego rwo hejuru ruzahuza imiyoboro ya HBM ikorerwa mububiko bwayo bwo kwibuka hamwe na GPU ziteranijwe kumasosiyete adafite ishingiro nishami ryayo.
Umukozi wa Samsung Electronics yagize ati: "Gupakira 3D bigabanya gukoresha amashanyarazi no gutinda gutunganywa, kuzamura ireme ry’ibimenyetso by’amashanyarazi bya chipi ya semiconductor".Mu 2027, Samsung irateganya gushyiraho uburyo-bumwe-bumwe bwa tekinoroji yo kwishyira hamwe ikubiyemo ibintu bya optique byongera cyane umuvuduko wo kohereza amakuru ya semiconductor muri pake imwe ihuriweho na yihuta ya AI.
Nk’uko byatangajwe na TrendForce, isosiyete ikora ubushakashatsi muri Tayiwani, ivuga ko mu rwego rwo kwiyongera kw'ibikenerwa ku mbaraga nkeya, zikora cyane, HBM iteganijwe kuzagera kuri 30% by'isoko rya DRAM mu 2025 kuva kuri 21% muri 2024.
Ubushakashatsi bwa MGI buteganya ko isoko ryateye imbere, harimo no gupakira 3D, rizagera kuri miliyari 80 z'amadolari muri 2032, ugereranije na miliyari 34.5 z'amadolari muri 2023.
Igihe cyo kohereza: Jun-10-2024