Gupakira ibikoresho bya semiconductor byahindutse kuva ku miterere gakondo ya 1D PCB kugera ku mibanire igezweho ya 3D hybrid ku rwego rwa wafer. Iri terambere ryemerera guhuza intera iri hagati ya mikoroni imwe, hamwe n'umuvuduko wa bandwidth ungana na 1000 GB/s, mu gihe bikomeza gukoresha ingufu nyinshi. Mu ikoranabuhanga rigezweho ryo gupakira ibikoresho bya semiconductor harimo gupakira ibikoresho bya 2.5D (aho ibice bishyirwa iruhande rw'urwego rw'intermediary) na gupakira ibikoresho bya 3D (bikubiyemo gushyiramo uduce duto duto). Ubu ikoranabuhanga ni ingenzi ku hazaza ha sisitemu za HPC.
Ikoranabuhanga ryo gupakira rya 2.5D rikoresha ibikoresho bitandukanye byo hagati, buri kimwe gifite ibyiza n'ibibi byacyo. Ibice byo hagati bya silicon (Si), birimo za wafer za silicon zidakora neza n'ibiraro bya silicon byaho, bizwiho gutanga ubushobozi bwiza bwo gufunga insinga, bigatuma biba byiza cyane mu gukoresha mudasobwa zikora neza. Ariko, birahenze mu bijyanye n'ibikoresho no mu nganda kandi bihura n'imbogamizi mu gace ko gupakira. Kugira ngo bigabanye ibi bibazo, ikoreshwa ry'ibiraro bya silicon byaho ririyongera, rikoresha silicon ahantu heza cyane mu gukemura ibibazo by'akarere.
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Ibyuma bihuza ikirahure byakunzwe cyane, cyane cyane nyuma y’aho Intel iherutse gutangiza ipaki y’imodoka zikoresha ikirahure. Ikirahure gifite ibyiza byinshi, nko kongera ubushyuhe (CTE), guhagarara neza mu buryo bworoshye, ubuso bworoshye kandi burambuye, ndetse n’ubushobozi bwo gushyigikira ikorwa ry’ibice binini, bigatuma kiba umukandida mwiza ku byuma bihuza ikirahure bifite ubushobozi bwo gufunga insinga bungana na silicon. Ariko, uretse imbogamizi za tekiniki, ikibazo gikomeye cy’ibyuma bihuza ikirahure ni uko ibidukikije bitarakomera ndetse no kutagira ubushobozi bunini bwo gukora. Uko ibidukikije bigenda bikura n’ubushobozi bwo gukora burushaho kwiyongera, ikoranabuhanga rishingiye ku kirahure mu gupakisha ibikoresho bikoresha ikirahure rishobora kongera kwiyongera no gukoreshwa.
Ku bijyanye n'ikoranabuhanga ryo gupakira ibintu mu buryo bwa 3D, Cu-Cu bump-less hybrid bonding irimo kuba ikoranabuhanga rigezweho. Ubu buryo bugezweho butuma habaho imikoranire ihoraho binyuze mu guhuza ibikoresho bya dielectric (nka SiO2) n'ibyuma byashyizwemo (Cu). Cu-Cu hybrid bonding ishobora kugera ku cyuho kiri munsi ya mikoroni 10, akenshi mu rwego rwa mikoroni imwe, bigaragaza iterambere rikomeye ugereranyije n'ikoranabuhanga risanzwe rya micro-bump, rifite icyuho cya mikoroni zigera kuri 40-50. Ibyiza byo guhuza ibintu mu buryo bwa hybrid birimo kwiyongera kwa I/O, kongera bandwidth, kunoza 3D vertical stacking, gukoresha neza ingufu, no kugabanya ingaruka za parasitic hamwe no kudakoresha ubushyuhe bitewe no kutagira hepfo y'amazi. Ariko, iri koranabuhanga riragoye kurikora kandi rifite ibiciro biri hejuru.
Ikoranabuhanga rya 2.5D na 3D rikubiyemo uburyo butandukanye bwo gupakira. Mu gupakira 2.5D, bitewe n'amahitamo y'ibikoresho by'urwego rw'ibanze, bishobora gushyirwa mu byiciro by'urwego rw'ibanze rushingiye kuri silikoni, urw'umwimerere, n'urw'ikirahure, nk'uko bigaragara ku ishusho iri hejuru. Mu gupakira 3D, iterambere ry'ikoranabuhanga rya micro-bump rigamije kugabanya ingano y'intera, ariko muri iki gihe, binyuze mu gukoresha ikoranabuhanga rya hybrid bonding (uburyo bwo guhuza Cu-Cu butaziguye), ingano y'intera y'umubare umwe ishobora kugerwaho, bigaragaza iterambere rikomeye mu rwego.
**Ibintu by'ingenzi by'ikoranabuhanga byo kwitondera:**
1. **Ubuso bunini bw'Ibyiciro by'Ibyiciro:** IDTechEx yari yarahanuye mbere ko bitewe n'ingorane z'ibyiciro by'ibyiciro by'ibyiciro bya silicon birenga umupaka wa 3x reticle, ibisubizo bya silicon bridge bya 2.5D byazasimbura vuba ibiti by'ibyiciro bya silicon nk'amahitamo y'ibanze yo gupakira chips za HPC. TSMC ni ikigo gikomeye gitanga ibiti by'ibyiciro bya silicon bya 2.5D kuri NVIDIA n'abandi bahanga mu gukora HPC nka Google na Amazon, kandi iyi sosiyete iherutse gutangaza ko ikora CoWoS_L yo mu gisekuru cya mbere ifite ingano ya 3.5x reticle. IDTechEx yiteze ko iyi gahunda izakomeza, hamwe n'iterambere rikomeje kuvugwa muri raporo yayo rireba abakinnyi bakomeye.
2. **Gupakira ku rwego rw'ibice:** Gupakira ku rwego rw'ibice byashyizwemo imbaraga cyane, nk'uko byagaragajwe mu Imurikagurisha Mpuzamahanga rya Semiconductor ryabereye muri Taiwan mu 2024. Ubu buryo bwo gupakira butuma hakoreshwa ibice binini kandi bugafasha kugabanya ikiguzi binyuze mu gukora ibice byinshi icyarimwe. Nubwo bushobora kubaho, imbogamizi nko gucunga imbunda zigomba gukemurwa. Gukomeza kwiyongera kwabwo bigaragaza ko hari byinshi bikeneye kandi bihendutse.
3. **Ibyuma Bihuza Ikirahure:** Ikirahure kiri kugaragara nk'igikoresho gikomeye cyo kugera ku nsinga nziza, zigereranywa na silikoni, hamwe n'ibindi byiza nka CTE ishobora guhindurwa no kwizerwa cyane. Ibyuma bihuza ikirahure nabyo bihuye n'ibipfunyika byo ku rwego rwo hejuru, bitanga amahirwe yo gufunga insinga nyinshi ku giciro cyoroshye, bigatuma kiba igisubizo cyiza ku ikoranabuhanga ryo gufunga mu gihe kizaza.
4. **HBM Hybrid Bonding:** Ubufatanye bwa 3D copper-copper (Cu-Cu) hybrid bonding ni ikoranabuhanga ry'ingenzi ryo kugera ku mikoranire myiza cyane hagati ya chips. Iri koranabuhanga ryakoreshejwe mu bicuruzwa bitandukanye bya seriveri, harimo AMD EPYC kuri stacked SRAM na CPUs, ndetse na MI300 series yo gushyira CPU/GPU blocks kuri I/O dies. Hybrid bonding byitezweho kugira uruhare runini mu iterambere rya HBM mu gihe kizaza, cyane cyane kuri stack za DRAM zirengeje 16-Hi cyangwa 20-Hi layers.
5. **Ibikoresho by'ikoranabuhanga bifatanye mu gukwirakwiza amakuru (CPO):** Bitewe n'ubwiyongere bw'igikenewe cyo gukoresha amakuru menshi no gukoresha neza ingufu, ikoranabuhanga ryo guhuza amakuru ryarushijeho kwitabwaho cyane. Ibikoresho by'ikoranabuhanga bifatanye mu gukwirakwiza amakuru (CPO) birimo kuba igisubizo cy'ingenzi cyo kongera uburyo bwo gukoresha amakuru mu buryo bwa I/O no kugabanya ikoreshwa ry'ingufu. Ugereranyije n'uburyo busanzwe bwo kohereza amakuru mu buryo bw'amashanyarazi, itumanaho rijyanye n'amashanyarazi ritanga ibyiza byinshi, birimo kugabanya ubushobozi bwo gukoresha amakuru mu ntera ndende, kugabanya ubushobozi bwo kuvugana, no kwiyongera cyane k'uburyo bwo gukoresha amakuru mu buryo bwa bandwidth. Ibi byiza bituma CPO iba amahitamo meza ku buryo bwo gukoresha amakuru menshi kandi bukoresha ingufu nke.
**Amasoko y'ingenzi yo kwitondera:**
Isoko ry’ibanze riteza imbere ikoranabuhanga ryo gupakira rya 2.5D na 3D nta gushidikanya ko ari urwego rw’ikoranabuhanga rigezweho (HPC). Ubu buryo bugezweho bwo gupakira ni ingenzi cyane mu kurenga inzitizi z’Itegeko rya Moore, bigatuma transistors nyinshi, ububiko, n’imikoranire mu ipaki imwe. Gusenyuka kwa chips binatuma habaho ikoreshwa ryiza ry’uduce duto tw’imikorere hagati y’uduce dutandukanye tw’imikorere, nko gutandukanya uduce twa I/O n’uduce dutunganya, bikongera ubushobozi.
Uretse mudasobwa zikora neza cyane (HPC), andi masoko nayo yitezweho gukura binyuze mu gukoresha ikoranabuhanga rigezweho ryo gupakira. Mu nzego za 5G na 6G, udushya nka antene zo gupakira n'ibisubizo bya chip bigezweho bizagena ahazaza h'imiterere y'umuyoboro wa wireless access network (RAN). Imodoka zigenga nazo zizakungukira, kuko izi koranabuhanga zishyigikira guhuza sensor suites na mudasobwa kugira ngo zikore amakuru menshi mu gihe zigenzura umutekano, ukwizerwa, ubucucike, imicungire y'ingufu n'ubushyuhe, hamwe no kugabanya ikiguzi.
Ibikoresho by'ikoranabuhanga bikoreshwa n'abaguzi (harimo telefoni zigendanwa, ama-smartwatches, ibikoresho bya AR/VR, mudasobwa, n'ibigo by'akazi) biri kwibanda cyane ku gutunganya amakuru menshi ahantu hato, nubwo hibandwa cyane ku giciro. Gupakira ibikoresho bya semiconductor bigezweho bizagira uruhare runini muri iki gikorwa, nubwo uburyo bwo gupakira bushobora gutandukana n'ubukoreshwa muri HPC.
Igihe cyo kohereza: Ukwakira-07-2024