Gupakira Semiconductor byahindutse kuva mumikino gakondo ya 1d ya PCB yo guca-inkombe ya 3d kuvanga kurwego rwa Wafer. Iri terambere ryemerera guhuza imitako kuri micron imwe micron, hamwe na bandidths zigera kuri 1000 GB / s, mugihe ukomeje imbaraga nyinshi. Intangiriro yububiko bwa semiconductor yateye imbere ni 2,5d gupakira (aho ibice bishyizwe kuruhande kuruhande rwabahuza) na 3D gupakira chips ikora). Izi tekinoroji ningirakamaro mugihe kizaza cya sisitemu ya HPC.
2.5D Ikoranabuhanga ripakira rikubiyemo ibikoresho bitandukanye byimiterere yigihugu, buri kimwe hamwe nibyiza byacyo nibibi. Silicon (si) ibice byimbere, harimo na pasiporo ya silicon byuzuye kandi bizwiho gutanga ubushobozi bwiza bwo kwisiga, bikaba byiza kubikorwa byo kubara. Ariko, barahenze mubijyanye nibikoresho no gukora no guhangana nibikorwa mubipfunyika. Gutegabanya ibyo bibazo, gukoresha ibiraro bya silicon byaho byaho byiyongera, bikoresha neza silicon aho imikorere myiza ari ingenzi mugihe akemura ako kantu.
Ibinyabuzima kama, ukoresheje fan-hanze ya plastiki byabumbwe, ni ubundi buryo buhendutse kuri silicon. Bafite imishinga yo hasi uhoraho, bigabanya RC gutinda muri paki. Nubwo ibyo byifuzo, ibice byimiterere kama barwana no kugera kurwego rumwe ruhuza nkibipakira bya silicon, bikabuza kurera kwabo mubisabwa murwego rwo kubara.
Ibirahuri bihuza ibirahuri byanze bikunze, cyane cyane nyuma yo gutangiza interl biherereye ibinyabiziga bishingiye ku kirahure. Ikirahure gitanga ibyiza byinshi, nko kugenzura neza kwaguka (cte), gushikama cyane, hamwe nubushobozi bwo gukora ikirango cyo gukora, hamwe nubushobozi bwo gukora ikirango cyo kwitwara hamwe nubushobozi bwo kwisiga bwagereranywa na silicon. Ariko, kuruhande rwibibazo bya tekiniki, gusubiramo nyamukuru ibirahuri bihuza ibinyabuzima ni ibidukikije bidakuze hamwe no kubura ubushobozi bunini. Nkuko ibidukikije bikura hamwe nubushobozi bwumusaruro butera imbere, ikoranabuhanga rishingiye ku kirahure mu gupakira semiconductor rishobora kubona iterambere no kurerwa.
Kubijyanye na tekinoroji ya 3d ya 3d, Cu-cu-Cu Bump-nkeya ihuza ihinduka tekinoroji yubuhanga. Ubu buhanga bwateye imbere bugera ku bufatanye buhoraho mu guhuza ibikoresho by'imirire (nka Sio2) hamwe n'ibyuma byinjijwe (CU). Ubufatanye bwa Cu-Cu Hybrid burashobora kugera kuri spoclings munsi ya micron 10, mubisanzwe mumibare mibi imwe, ihagarariye iterambere ryinshi ryikoranabuhanga risanzwe ryikoranabuhanga rya micro-bump, rifite sprictions zigera kuri 40-50. Ibyiza byo guhuza imvange harimo kongera I / O, kuzamura umurongo wa 3d uhagaze, imbaraga nziza zometseho, kandi kugabanya imigenzo ya parasitike, no kurwanya imitiba biterwa no kubura hasi. Ariko, ubu buhanga ni ingorabahizi gukora kandi ifite ibiciro byinshi.
2.5d na 3d gupakira tekinoroji ikubiyemo uburyo butandukanye bwo gupakira. Muri 2.5d gupakira, bitewe nuburyo bwo guhitamo ibikoresho byimiterere, birashobora gushyirwa mu byiciro mu bikoresho bishingiye kuri silicon, bishingiye kuri kama, n'ibihuri bishingiye ku kirahure, nkuko bigaragara ku gishushanyo kiri hejuru. Mu gupakira 3D, iterambere ry'ikoranabuhanga rya Micro-Bump rigamije kugabanya ibipimo ngenderwaho.
** Ibikorwa byingenzi bya tekinoroji yo kureba: **
1. ** Ibinini binini byo hagati: ** IDTECHEX yahanuye ko bitewe ningorabahizi zo hagati ya silicon zirenze urugero rwa silicon zirenga miliyoni 3x. TSMC numutanga munini wa 2.5D Silicon Abahuza Abahuza Nvidia hamwe nizindi bateza imbere ya HPC nka Google na Amazon, hamwe na sosiyete iherutse gutangazwa kubyara umusaruro wa mbere inka -l hamwe na 3.5x Ingano ya 3.5x. Idtechex yiteze ko iki kintu gikomeza, hamwe niterambere ryinshi ryaganiriweho muri raporo yayo ikubiyemo abakinnyi bakomeye.
2. ** Gupakira urwego: ** Gupakira urwego-urwego rwibanze cyane, nkuko bigaragara mu imurikagurisha mpuzamahanga rya 2024 rya Tayiwani. Ubu buryo bwo gupakira bwemerera gukoresha ibice binini byo mu bahuza kandi bifasha kugabanya ibiciro mu gutanga ibisigazwa byinshi icyarimwe. Nubwo ubushobozi bwayo, ibibazo nkubuyobozi bwintambara bugomba gukemurwa. Kwiyongera kwamamaye byerekana ibyifuzo byiyongera kubinini binini, byinshi bihendutse.
3. ** Ikirahure Hagati: ** Ikirahure kigaragara nkigikoresho gikomeye cyumukandida kugirango ugere kurwara neza, ugereranije na silicon, hamwe ninyongera yinyongera nka cte yiringirwa. Ibirahuri bihuza ibirahuri nabyo birahuye nibipanda-urwego-urwego, gutanga ubushobozi bwo kwibira hejuru-kwibira mu biciro byacungwa, bikaba igisubizo gitanga ikizere kubipabyo bizaza.
4. ** HBM Hybrid Bonding: ** 3D Umuringa-Umuringa (Cu-Cu) Ihangane nikoranabuhanga ryingenzi kugirango ugere kuri ulttic ihagaze hagati ya chip. Iri koranabuhanga ryakoreshejwe mubicuruzwa bitandukanye bya seriveri binyuranye, harimo na AMD EPYC kuri Straction yashyizwe kumurongo wa Mi300 yo gufunga CPU / GPU Block kuri I / O birapfa. Biteganijwe ko amarira ya Hybrid azagira uruhare rukomeye mu iterambere rya HBM, cyane cyane ku bice bihanitse birenze 16-HI cyangwa 20-muraho.
5. ** ibikoresho bya optique byapakiwe (CPO): ** Hamwe no Gukoresha Amakuru Yisumbuye Yiyakoreshejwe hamwe nubuhanga bwo guhuza neza, tekinoroji ya Optique yatsinzwe cyane. Ibikoresho byo gupakira byatoranijwe (CPO) bihinduka igisubizo cyingenzi cyo kuzamura I / o igweti no kugabanya ibiyobyabwenge. Ugereranije no kwanduza gakondo gakondo, itumanaho ryiza ritanga ibyiza byinshi, harimo no kwinjiza hejuru yintera ndende, byagabanije ibintu byinshi, byagabanutse ku mibonano mpuzabitsina, kandi byiyongereye cyane. Izi nyungu zituma CPO ihitamo ryiza ryamakuru-rikomeye, sisitemu ya HPC.
** Amasoko yingenzi kugirango urebe: **
Isoko ryibanze ritwara iterambere rya 2.5D kandi 3d ipakiro ryumurenge wo murwego rwohejuru (HPC). Ubu buryo bwo gupakira ni ngombwa mu gutsinda amategeko ya Moore, bigatuma abantu benshi, kwibuka, no guhuza muri paki imwe. Kwangirika kwa chip nabyo bituma habaho uburyo bwiza bwo gukoresha ibintu bifatika, nko gutandukanya I / o guhagarika i / o guhagarika ibikoresho byo gutunganya, gukomeza gukora neza.
Usibye kubara cyane (HPC), ibindi masoko nabyo biteganijwe kandi kugera ku iterambere binyuze mu kwemeza tekinoroji yo gupakira. Mu nzego za 5G na 6G, udushya nko gupakira antennas no guca imbuga ya chip bizahindura ejo hazaza h'umuyoboro wa fireless (Ran) Ubwubatsi. Ibinyabiziga byigenga nabyo bizagirira akamaro, nkuko tekinoroji ishyigikira kwishyira hamwe kwa Ssersor Suites no kubara ibice byinshi mugihe utanga umutekano, kwizerwa, ubuyobozi, ubuyobozi bwumuhanda, hamwe nubuyobozi bwumuhanda.
Amashanyarazi y'abaguzi (harimo na terefone, imitekerereze, AR / VR, PC, n'ibikorwa) bigenda byibandaho mugutunganya amakuru mato mumwanya muto, nubwo hashimangiwe cyane. Gupakira semiconductor yateye imbere bizagira uruhare runini muriyi nzira, nubwo uburyo bwo gupakira bushobora gutandukana nibikoreshwa muri HPC.
Igihe cyo kohereza: Ukwakira-07-2024