Isoko ry’ibikoresho byo gupakira no gupima ibikoresho bya semiconductor ku isi ryitezweho gukomeza kwiyongera mu 2026, bitewe n’ubwiyongere bw’ibikenewe bivuye mu ikoranabuhanga ry’ubukorano, ibikoresho by’ikoranabuhanga by’imodoka, n’ikoranabuhanga rigezweho.
Abasesenguzi b’inganda bavuga ko ikoranabuhanga rigezweho ryo gupakira, harimo gupakira mu buryo bwa "fan-out wafer-level packaging" (FOWLP), gupakira mu buryo bwa "2.5D" na "3D", ririmo kugenda rirushaho kuba ingenzi mu gihe abakora chips bakurikirana uburyo bwo gushyira hamwe ibintu byinshi no gupima imiterere mito.
Ishoramari rikomeje kwiyongera mu nganda zikora ibikoresho bya semiconductor ku isi yose, rinashyigikira kwaguka kw'uruhererekane rw'ibikoresho byo gupakira. Uko ibikoresho by'ikoranabuhanga bigenda birushaho kuba ingirakamaro kandi bihuzwa, hazabaho gukenera ibisubizo byizewe kandi binoze byo gupakira mu buryo bworoshye mu nzego z'abaguzi, inganda n'imodoka.
Igihe cyo kohereza ubutumwa: Werurwe-02-2026